Xgig U.2-CEM, 4-lane Interposer Module for PCI Express 4.0

Interposer Module for PCI Express 4.0 Platform

This U.2-CEM Interposer is optimized for NVMe SSD development enabling debug and analysis

The VIAVI Solutions 4-lane, U.2-CEM Interposer for PCIe 4.0 uses high-speed linear signal redrivers to buffer the PCIe data lanes across the Interposer between host system and SSD devices-under-test. This Interposer enables debug and verification of new NVMe controller ICs, new system implementations, firmware, validation of system BIOS and software, and is used for manufacturing test quality assurance. It supports full decode and analysis of NVMe and PCIe traffic including NVMe-MI protocol.ing, equalization and other in-band and side-band data


  • Operates up to 16GTps, PCIe 4.0 data rates
  • Downward compatible with PCIe 1.0, 2.0 and 3.0 data rates of 2.5, 5.0 and 8.0GTps
  • Supports links of up to and including 4-lanes
  • NVMe SSD DUT (not supplied) plugs directly into the Interposer
  • Supplied with two high-performance custom cables for Analyzer attachment
  • Data path uses high-speed linear redrivers to ensure good signal capture with little or no tuning
  • Supports Analyzer side-band signal capture and triggering
  • Provides two differential clock connectors
  • Interposer power is independent of host system
  • A 120/220 AC in, 12V/3A DC output converter is included
  • LEDs give quick indicators of power and status
  • Format: Design based on 4-lane PCIe CEM specification
  • Supported by VIAVI Analyzer tools for trace capture with filter, trigger and more
  • Provides consistent, repeatable capture of link training, negotiation and other data
  • Supports error injection for deep system analysis
  • Supported by Xgig tool suite including Trace Control, Expert and Serialytics


  • Used for NVMe controller IC, sub-system and system level debug
  • Supports firmware and driver development, validation, and performance tuning
  • Works together with the VIAVI PCIe4 and PCIe5 Analyzer/Jammer platform


  • Faster analysis and problem isolation
  • Quicker time to market and earlier revenue
  • Lower engineering costs
  • Provides consistent, repeatable capture of link training, equalization and other in-band and side-band data

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