Xgig U.2B-Server, 4-lane Interposer Module for PCI Express 4.0

The VIAVI Solutions 4-lane, U.2B-Server Interposer for PCIe 4.0 uses high-speed linear signal redrivers to restore signal quality of the PCIe data lanes across the Interposer between host system and SSD devices-under-test. This Interposer enables debug and verification of new NVMe controller ICs, new system implementations, firmware, validation of system BIOS and software, and for manufacturing test quality assurance.

Highlights

• Operates up to and including 16GTps, PCIe 4.0 data rates
• Downward compatible with PCIe 1.0, 2.0 and 3.0 data rates of 2.5, 5.0 and 8.0GTps
• Supports 1 link of 4 lanes, or dual-port operation of 2 links of 2 lanes each
• Front-end module plugs into system-under-test
• U.2 NVMe SSD DUT (not supplied) plugs into the Back-end module
• Adjustable tray clamps and quick-release latch allow for snug fit and hot swap testing
• Data path uses high-speed linear redrivers to ensure good signal capture with minimal tuning
• Supplied with high-quality, custom SFF-8764 cables for Analyzer system attachment
• Supports side-band signal triggering and capture
• Supplied power brick makes Interposer power independent of host system
• LEDs give quick indicators of power and status
• Works with VIAVI Xgig 4K4 and 4K16 PCIe 4.0 Analyzer/Jammer chassis
• Provides consistent, repeatable capture of link training, negotiation and other data
• Supports error injection for deep system analysis
• Supported by Xgig tool suite including Trace Control, Expert and Serialytics

Applications

• Optimized for development, debugging and performance tuning of NVMe SSD operation in high-density storage servers
• Used for IC development, debug and validation, subsystem and system-level testing, firmware and driver development and validation, and performance analysis
• Works with VIAVI Xgig 4K4 and 4K16 PCIe 4.0 Analyzer/Jammer chassis

Benefits

• Provides consistent, repeatable capture of link training, equalization and other in-band and side-band data
• Faster analysis and problem isolation
• Quicker time to market and earlier revenue
• Lower engineering costs